Invention Grant
- Patent Title: High frequency interconnect signal transmission lines
- Patent Title (中): 高频互连信号传输线
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Application No.: US11643269Application Date: 2006-12-20
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Publication No.: US07804663B2Publication Date: 2010-09-28
- Inventor: Toshiki Hirano , Nobumasa Nishiyama , Haruhide Takahashi
- Applicant: Toshiki Hirano , Nobumasa Nishiyama , Haruhide Takahashi
- Applicant Address: NL Amsterdam
- Assignee: Hitachi Global Storage Technologies Netherlands B.V.
- Current Assignee: Hitachi Global Storage Technologies Netherlands B.V.
- Current Assignee Address: NL Amsterdam
- Main IPC: G11B5/48
- IPC: G11B5/48
Abstract:
A micro-electromechanical signal transmission line is made from an electrically conductive material. It has a first distal end and a second distal end. The second distal end is free to move with respect to said first distal end. There exists an unsupported region between the first distal end and the second distal end. The unsupported region is juxtaposed at a controlled distance from at least one grounded conductive surface.
Public/Granted literature
- US20080151432A1 High frequency interconnect signal transmission lines Public/Granted day:2008-06-26
Information query
IPC分类:
