Invention Grant
- Patent Title: Electronic device component eject mechanism
- Patent Title (中): 电子设备部件弹出机构
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Application No.: US11821345Application Date: 2007-06-21
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Publication No.: US07804683B2Publication Date: 2010-09-28
- Inventor: Janne T. Kilpinen
- Applicant: Janne T. Kilpinen
- Applicant Address: FI Espoo
- Assignee: Nokia Corporation
- Current Assignee: Nokia Corporation
- Current Assignee Address: FI Espoo
- Agency: Harrington & Smith
- Main IPC: G06F1/16
- IPC: G06F1/16 ; H05K5/00 ; H05K7/00 ; H01R13/62

Abstract:
Disclosed herein is a portable electronic device component eject mechanism. The portable electronic device component eject mechanism includes a first member and a second member. The first member is configured to contact a first portable electronic device component. The second member is movably connected to the first member. The second member is configured to release a second portable electronic device component when the second member is moved in a first direction. The first member is configured to eject the first component when the second member is moved in a second direction. The first component and the second component comprise a removable electronic module and a battery.
Public/Granted literature
- US20080316684A1 Electronic device component eject mechanism Public/Granted day:2008-12-25
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