A method and system for placing multiple loads in a high-speed system are disclosed. In one embodiment, the first load and the second load are placed on the first side and the second side of the printed circuit board, respectively. In addition, the first signal pin of the first load is vertically aligned with the second signal pin of the second load with an offset; the terminating end of a trace, which is connected to a driver on the printed circuit board, the first signal pin, and the second signal pin are connected at a T-point. The printed circuit also includes the first decoupling capacitor on the second side and the second decoupling capacitor on the first side. The first decoupling capacitor is connected to the first power pin of the first load. Similarly, the second decoupling capacitor is connected to a second power pin of the second load.