Invention Grant
US07804993B2 Method and apparatus for detecting defects in wafers including alignment of the wafer images so as to induce the same smear in all images
有权
用于检测晶片中的缺陷的方法和装置，包括晶片图像的对准，以便在所有图像中引起相同的涂片
- Patent Title: Method and apparatus for detecting defects in wafers including alignment of the wafer images so as to induce the same smear in all images
- Patent Title (中): 用于检测晶片中的缺陷的方法和装置，包括晶片图像的对准，以便在所有图像中引起相同的涂片
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Application No.: US11068711Application Date: 2005-02-28
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Publication No.: US07804993B2Publication Date: 2010-09-28
- Inventor: Yuval Dorphan , Ran Zaslavsky , Mark Wagner , Dov Furman , Shai Silberstein
- Applicant: Yuval Dorphan , Ran Zaslavsky , Mark Wagner , Dov Furman , Shai Silberstein
- Applicant Address: SG Singapore
- Assignee: Applied Materials South East Asia Pte. Ltd.
- Current Assignee: Applied Materials South East Asia Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: Sonnenchein Nath & Rosenthal LLP
- Main IPC: G06K9/00
- IPC: G06K9/00 ; G06K9/40
Abstract:
A method for inspecting a wafer including a multiplicity of dies, the method including dividing an image of at least a portion of the wafer into a plurality of sub-images each representing a sub-portion of the wafer and selecting at least one defect candidate within each sub-image by comparing each sub-image to a corresponding sub-image of a reference including a representation, which is assumed to be faultless, of the portion of the wafer.
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