Invention Grant
- Patent Title: Detachable earphone structure
- Patent Title (中): 可拆卸耳机结构
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Application No.: US11850740Application Date: 2007-09-06
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Publication No.: US07805109B2Publication Date: 2010-09-28
- Inventor: Tse-Ming Tsai , Chen-Yi Hsiao , Shang-Hsing Chung
- Applicant: Tse-Ming Tsai , Chen-Yi Hsiao , Shang-Hsing Chung
- Applicant Address: TW Taipei
- Assignee: Cal-Comp Electronics and Communications Company Limited
- Current Assignee: Cal-Comp Electronics and Communications Company Limited
- Current Assignee Address: TW Taipei
- Agency: HDLS IPR Services
- Agent Chun-Ming Shih
- Main IPC: H04B7/00
- IPC: H04B7/00 ; H04M1/00
Abstract:
A detachable earphone structure includes an earphone body and a transmitter detachable from the earphone body. The earphone body has an opening portion, a pair of connecting terminals installed in the opening portion and electrically connected to an internal circuit. The transmitter has a pair of contact terminals stored in the opening portion of the earphone body or detachably connected to the earphone body for electrically conducting the connecting terminal and the contact terminal through the contact of the connecting terminal with the contact terminal.
Public/Granted literature
- US20090068945A1 DETACHABLE EARPHONE STRUCTURE Public/Granted day:2009-03-12
Information query
