Invention Grant
- Patent Title: Method for local hot spot fixing
- Patent Title (中): 本地热点固定方法
-
Application No.: US11748599Application Date: 2007-05-15
-
Publication No.: US07805692B2Publication Date: 2010-09-28
- Inventor: Shwang-Ming Jeng
- Applicant: Shwang-Ming Jeng
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
Efficient and cost-effective systems and methods for detecting and correcting hot spots of semiconductor devices are disclosed. In one aspect, a method includes providing an input file having a device layout; performing a hot spot detection on the input file; and then modifying the device layout based on the hot spots detected to create an output file. In another aspect, a method includes providing an input file having a device layout; selecting a first local region of the device layout; performing a first hot spot detection on the first local region; modifying the first local region based on the hot spots detected to create a first output file; and repeating for other local regions of the device layout. In some aspects, hot spots are detected by comparing parameters of the device layout with a set of hot spot rules to determine if the device layout satisfies the hot spot rules.
Public/Granted literature
- US20070264731A1 Method for Local Hot Spot Fixing Public/Granted day:2007-11-15
Information query