Invention Grant
- Patent Title: Control of white-etched layer during machining
- Patent Title (中): 加工过程中白蚀刻层的控制
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Application No.: US12779191Application Date: 2010-05-13
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Publication No.: US07805824B2Publication Date: 2010-10-05
- Inventor: Tahany Ibrahim El-Wardany , Sergei F. Burlatsky , Changsheng Guo , Wayde R. Schmidt
- Applicant: Tahany Ibrahim El-Wardany , Sergei F. Burlatsky , Changsheng Guo , Wayde R. Schmidt
- Applicant Address: US CT Hartford
- Assignee: United Technologies Corporation
- Current Assignee: United Technologies Corporation
- Current Assignee Address: US CT Hartford
- Agency: Carlson, Gaskey & Olds, P.C.
- Main IPC: B23P23/00
- IPC: B23P23/00 ; B23D43/02

Abstract:
A machining system includes a support configured to retain an article, such as a rotor disk, having an area, such as a surface of a slot in the disk. A cutting tool, for example, a broach, is movable relative to the support to cut the area. A heating member, such as a laser, is configured to locally heat the area of the article. In one example, the cutting tool includes a body having a cutting edge. The heating member is supported by the body and is configured to provide heat adjacent to the cutting edge. The cutting edge cuts the locally heated area while the area is still heated.
Public/Granted literature
- US20100218657A1 CONTROL OF WHITE-ETCHED LAYER DURING MACHINING Public/Granted day:2010-09-02
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