Invention Grant
- Patent Title: Method of forming an electrical connector
- Patent Title (中): 形成电连接器的方法
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Application No.: US11882555Application Date: 2007-08-02
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Publication No.: US07805838B2Publication Date: 2010-10-05
- Inventor: Francis P. Morana , Mark M. Ayzenberg
- Applicant: Francis P. Morana , Mark M. Ayzenberg
- Applicant Address: US MA Hudson
- Assignee: Hypertronics Corporation
- Current Assignee: Hypertronics Corporation
- Current Assignee Address: US MA Hudson
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, LLP
- Main IPC: H01R43/00
- IPC: H01R43/00
Abstract:
A method of forming an electrical connector includes winding a conducting wire around a carrier strip, cutting the carrier strip to a desired length, forming the carrier strip into a cylindrical member to form an inner tube subassembly, and inserting the inner tube subassembly into an outer tube.
Public/Granted literature
- US20090036003A1 Method of forming an electrical connector Public/Granted day:2009-02-05
Information query
