Invention Grant
- Patent Title: Shingle with low density granules and/or backdust
- Patent Title (中): 与低密度颗粒和/或回水泥混合
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Application No.: US12420873Application Date: 2009-04-09
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Publication No.: US07805909B2Publication Date: 2010-10-05
- Inventor: Yishien H. Teng , Sanjay Mansukhani
- Applicant: Yishien H. Teng , Sanjay Mansukhani
- Agency: MacMillan, Sobanski & Todd, LLC
- Main IPC: B05D1/24
- IPC: B05D1/24 ; B05D1/10 ; B05D1/12 ; E04G1/00
Abstract:
A roofing shingle has low density granules adhered to at least a headlap region on a front surface of the roof shingle.
Public/Granted literature
- US20090249728A1 Shingle With Low Density Granules And/Or Backdust Public/Granted day:2009-10-08
Information query
