Invention Grant
- Patent Title: Heat dissipation device
- Patent Title (中): 散热装置
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Application No.: US11767014Application Date: 2007-06-22
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Publication No.: US07806167B2Publication Date: 2010-10-05
- Inventor: Wei-Le Wu , Chun-Chi Chen
- Applicant: Wei-Le Wu , Chun-Chi Chen
- Applicant Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- Assignee: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.,Foxconn Technology Co., Ltd.
- Current Assignee: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.,Foxconn Technology Co., Ltd.
- Current Assignee Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- Agent Jeffrey T. Knapp
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
A heat dissipation device includes a base, a first fin group located above the base, at least one heat pipe connecting the base and the first fin group and first and second fans located at two opposite sides of the first fin group. Each of the first and second fans is oriented with an acute angle to the base. Outlet and inlet of the first and second fans are oriented towards the base and the first fan produces cooling air to blow towards the first fin group and the base and the second fan draws heated air away from the first fin group and the base.
Public/Granted literature
- US20080314555A1 HEAT DISSIPATION DEVICE Public/Granted day:2008-12-25
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