Invention Grant
- Patent Title: Heat exchanger
- Patent Title (中): 热交换器
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Application No.: US11660468Application Date: 2005-07-20
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Publication No.: US07806170B2Publication Date: 2010-10-05
- Inventor: Yoichi Nakamura
- Applicant: Yoichi Nakamura
- Applicant Address: JP Tokyo
- Assignee: T. Rad Co., Ltd.
- Current Assignee: T. Rad Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Jordan and Hamburg LLP
- Priority: JP2004-239337 20040819
- International Application: PCT/JP2005/013688 WO 20050720
- International Announcement: WO2006/018953 WO 20060223
- Main IPC: F28F9/02
- IPC: F28F9/02

Abstract:
In a heat exchanger having a casing in which a joint of the casing and between a core and the casing are brazed and fixed without a gap, the section of a portion in contact with the casing body is formed at a right angle at both ends of an upper edge portion of a header plate, and an upper lid is fitted so that it is brought into contact with the upper edge of the header plate over the entire length.
Public/Granted literature
- US20070246207A1 Heat Exchanger Public/Granted day:2007-10-25
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