Invention Grant
- Patent Title: Method of installing IC tag
- Patent Title (中): 安装IC标签的方法
-
Application No.: US11448153Application Date: 2006-06-07
-
Publication No.: US07806340B2Publication Date: 2010-10-05
- Inventor: Fumio Daio , Kazunori Haraguchi
- Applicant: Fumio Daio , Kazunori Haraguchi
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2005-167115 20050607
- Main IPC: G06K19/06
- IPC: G06K19/06

Abstract:
An IC chip in an IC tag is provided with a voltage application terminal in connection with its internal circuit, and a high voltage or a reverse voltage is applied to the voltage application upon unlawful handling of the IC tag, so that the IC chip is electrically broken down. In this way, an IC tag installed in an item is prevented from being misused when the IC tag is no longer necessary or being removed for misuse.
Public/Granted literature
- US20070019349A1 Method of installing IC tag Public/Granted day:2007-01-25
Information query