Invention Grant
- Patent Title: Underground filling and sealing method
- Patent Title (中): 地下灌装封口方法
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Application No.: US11787629Application Date: 2007-04-17
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Publication No.: US07806631B2Publication Date: 2010-10-05
- Inventor: Eric W. Smith , Homer D. Libengood
- Applicant: Eric W. Smith , Homer D. Libengood
- Agent Gerald K. White
- Main IPC: E02D3/12
- IPC: E02D3/12
Abstract:
The present invention is directed to a method for filling and sealing underground voids and the like with use of a grout comprising aggregate coated with a water-activated expanded hydrophobic polymeric resin, such as polyurethane.
Public/Granted literature
- US20080260473A1 Underground filling and sealing method Public/Granted day:2008-10-23
Information query
