Invention Grant
- Patent Title: Injection molding machine with resin pressure gradient detection
- Patent Title (中): 注塑机采用树脂压力梯度检测
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Application No.: US12130066Application Date: 2008-05-30
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Publication No.: US07806675B2Publication Date: 2010-10-05
- Inventor: Junpei Maruyama , Shingo Komiya
- Applicant: Junpei Maruyama , Shingo Komiya
- Applicant Address: JP
- Assignee: Fanuc Ltd
- Current Assignee: Fanuc Ltd
- Current Assignee Address: JP
- Agency: Lowe Hauptman Ham & Berner, LLP
- Priority: JP2007-153812 20070611
- Main IPC: B29C45/77
- IPC: B29C45/77

Abstract:
Suck back is started and a gradient of pressure (an amount of change in resin pressure while a screw or a plunger moves backward by a certain amount) is detected. Whether or not an absolute value of the detected gradient of the pressure is smaller than a reference value set in advance is determined, and it is determined that the reduction of the resin pressure has been completed when the absolute value becomes smaller than the reference value. A screw position at the time of the completion of the pressure reduction is stored and a screw movement amount from a suck back start position to a pressure reduction completion position is displayed on a screen.
Public/Granted literature
- US20080305200A1 INJECTION MOLDING MACHINE Public/Granted day:2008-12-11
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