Invention Grant
- Patent Title: Edge card connector assembly with high-speed terminals
- Patent Title (中): 边缘卡连接器组件带有高速端子
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Application No.: US12290117Application Date: 2008-10-27
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Publication No.: US07806698B2Publication Date: 2010-10-05
- Inventor: Kent E. Regnier
- Applicant: Kent E. Regnier
- Applicant Address: US IL Lisle
- Assignee: Molex Incorporated
- Current Assignee: Molex Incorporated
- Current Assignee Address: US IL Lisle
- Agent Stephen L. Sheldon
- Main IPC: H01R24/00
- IPC: H01R24/00

Abstract:
A surface mount connector for high speed data transfer application has an insulative housing with a vertically-oriented circuit card-receiving slot disposed along a front face thereof. A plurality of conductive terminals are supported by the housing so that contact portions of the terminals extend into the card slot. The terminals are formed with a thin configuration to reduce the overall capacitance of the terminals as a group as a means of regulating the impedance thereof. The terminals are supported on opposing sidewalls of the connector housing and each of the terminals includes a tail portion, a contact portion and a retention portion that engages the connector housing so that the contact portions are cantilevered in their extent within the housing.
Public/Granted literature
- US20090124128A1 Edge card connector assembly with high-speed terminals Public/Granted day:2009-05-14
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