Invention Grant
- Patent Title: Method of manufacturing disk substrate
- Patent Title (中): 盘基片的制造方法
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Application No.: US12337205Application Date: 2008-12-17
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Publication No.: US07806751B2Publication Date: 2010-10-05
- Inventor: Tetsuo Suzuki , Yoshio Kawakami , Kazuhiro Nakiri
- Applicant: Tetsuo Suzuki , Yoshio Kawakami , Kazuhiro Nakiri
- Applicant Address: JP Tokyo JP Hamamatsu-shi
- Assignee: The Furukawa Electric Co., Ltd.,Shoda Techtron Corp.
- Current Assignee: The Furukawa Electric Co., Ltd.,Shoda Techtron Corp.
- Current Assignee Address: JP Tokyo JP Hamamatsu-shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2006-309637 20061115
- Main IPC: B24B1/00
- IPC: B24B1/00
Abstract:
A method of manufacturing a disk substrate includes a disk substrate forming step of forming a disk substrate; and an outer chamfering step of chamfering an outer edge of the disk substrate. The outer chamfering step includes chamfering the outer edge by bringing an end surface of a cylindrical-shaped outer chamfering grindstone having a hollow portion on its end into contact with the outer edge such that the hollow portion faces the outer edge while rotating each of the outer chamfering grindstone and the disk substrate.
Public/Granted literature
- US20090104853A1 METHOD OF MANUFACTURING DISK SUBSTRATE Public/Granted day:2009-04-23
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