Copper-based alloy, and cast ingot and liquid-contacting part each using the alloy

Invention Grant

US07806996B2 Copper-based alloy, and cast ingot and liquid-contacting part each using the alloy 有权

Title translation: 铜基合金，铸锭和液体接触部分，各自使用合金

Patent Title: Copper-based alloy, and cast ingot and liquid-contacting part each using the alloy
Patent Title (中): 铜基合金，铸锭和液体接触部分，各自使用合金
Application No.: US11798245

Application Date: 2007-05-11
Publication No.: US07806996B2

Publication Date: 2010-10-05
Inventor: Kazuhito Kurose , Yukihiro Hirata , Tomoyuki Ozasa , Hisanori Terui
Applicant: Kazuhito Kurose , Yukihiro Hirata , Tomoyuki Ozasa , Hisanori Terui
Applicant Address: JP Chiba
Assignee: Kitz Corporation
Current Assignee: Kitz Corporation
Current Assignee Address: JP Chiba
Agency: Wenderoth, Lind & Ponack, L.L.P.
Main IPC: C22C9/02
IPC: C22C9/02 ; C22C9/04

Abstract:

A copper-based alloy essentially includes 5.0 to 10.0 wt % of Zn, 2.8 to 5.0 wt % of Sn, 0.4 to 3.0 wt % of Bi, 0

Abstract(Chinese):

铜基合金基本上含有5.0〜10.0重量％的Zn，2.8〜5.0重量％的Sn，0.4〜3.0重量％的Bi，0

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