Invention Grant
- Patent Title: Method for electrochemical mechanical polishing
- Patent Title (中): 电化学机械抛光方法
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Application No.: US12558647Application Date: 2009-09-14
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Publication No.: US07807038B2Publication Date: 2010-10-05
- Inventor: Joseph G. Ameen , David B. James
- Applicant: Joseph G. Ameen , David B. James
- Applicant Address: US DE Newark
- Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Current Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Current Assignee Address: US DE Newark
- Agent Thomas S. Deibert
- Main IPC: B23H5/08
- IPC: B23H5/08
Abstract:
The present invention provides a method of electrochemical polishing of a workpiece using a polishing pad having a cellular polymeric layer overlying a conductive substrate, the cellular polymeric layer having a thickness less than 1.5 mm; wherein the cellular polymeric layer comprises a plurality of pores that extend through the thickness of the cellular polymeric layer from a polishing surface of the cellular polymeric layer to the conductive substrate; and wherein the plurality of pores exhibit a diameter that is smaller at the polishing surface than at the conductive substrate.
Public/Granted literature
- US20100000877A1 Method for electrochemical mechanical polishing Public/Granted day:2010-01-07
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