Invention Grant
- Patent Title: Method of manufacturing a porous resin substrate having perforations and method of making a porous resin substrate including perforations having electrically conductive wall faces
- Patent Title (中): 具有穿孔的多孔树脂基板的制造方法以及包括具有导电壁面的穿孔的多孔树脂基板的制造方法
-
Application No.: US11660993Application Date: 2005-07-11
-
Publication No.: US07807066B2Publication Date: 2010-10-05
- Inventor: Mayo Uenoyama , Yasuhiro Okuda , Fumihiro Hayashi , Taro Fujita , Yasuhito Masuda , Yuichi Idomoto
- Applicant: Mayo Uenoyama , Yasuhiro Okuda , Fumihiro Hayashi , Taro Fujita , Yasuhito Masuda , Yuichi Idomoto
- Applicant Address: JP Osaka
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2004-241756 20040823
- International Application: PCT/JP2005/012768 WO 20050711
- International Announcement: WO2006/022083 WO 20060203
- Main IPC: B31D3/00
- IPC: B31D3/00

Abstract:
A method of manufacturing a perforated porous resin substrate, the method including the following steps: Step 1 of forming at least one perforation penetrating in the thickness direction from a first surface to a second surface in a porous resin substrate made of a resin material containing a fluoropolymer; Step 2 of etching treatment conducted by putting an etchant containing an alkali metal in contact with the wall face of each perforation; and Step 3 of putting an oxidizable compound or a solution thereof in contact with a degenerative layer generated by the etching treatment, and thereby removing the degenerative layer. A method of manufacturing a porous resin substrate in which electrical conductivity is afforded to the wall face of the perforation.
Public/Granted literature
Information query