Invention Grant
- Patent Title: Method of semiconductor device protection, package of semiconductor device
- Patent Title (中): 半导体器件保护方法，半导体器件封装
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Application No.: US12081961Application Date: 2008-04-24
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Publication No.: US07807481B2Publication Date: 2010-10-05
- Inventor: Kazuhiro Tashiro , Keisuke Fukuda , Naohito Kohashi , Shigeyuki Maruyama
- Applicant: Kazuhiro Tashiro , Keisuke Fukuda , Naohito Kohashi , Shigeyuki Maruyama
- Applicant Address: JP Yokohama
- Assignee: Fujitsu Semiconductor Limited
- Current Assignee: Fujitsu Semiconductor Limited
- Current Assignee Address: JP Yokohama
- Agency: Westmean, Hattori, Daniels & Adrian, LLP
- Priority: JP2003-348796 20031007
- Main IPC: H01L21/66
- IPC: H01L21/66
Abstract:
A method for protecting a semiconductor device is disclosed that can improve reliability of a performance test for the semiconductor device and prevent damage to the semiconductor device during transportation or packaging for shipment. An IC cover is attached to the semiconductor device, which has height unevenness because it includes semiconductor chips and electric parts having different heights. The IC cover includes projecting portions and a base portion. After being attached to the semiconductor device, the projecting portions stand in a free area in the semiconductor device, and the base portion is supported by the projections to be separated from the semiconductor chips and electric parts in the semiconductor device. The IC cover is detachably attached to the semiconductor device.
Public/Granted literature
- US20080203558A1 Method of semiconductor device protection, package of semiconductor device Public/Granted day:2008-08-28
Information query
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