Invention Grant
- Patent Title: Method of manufacturing semiconductor element
- Patent Title (中): 制造半导体元件的方法
-
Application No.: US12071917Application Date: 2008-02-27
-
Publication No.: US07807554B2Publication Date: 2010-10-05
- Inventor: Haruo Nakazawa
- Applicant: Haruo Nakazawa
- Applicant Address: JP Tokyo
- Assignee: Fuji Electric Systems Co., Ltd.
- Current Assignee: Fuji Electric Systems Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Rabin & Berdo, PC
- Priority: JP2007-049087 20070228
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
A method of manufacturing a semiconductor element includes implanting ions of a dopant having a large diffusion coefficient into a semiconductor to provide a doped layer; and irradiating the doped layer with a plurality of pulsed laser beams supplied by a plurality of laser irradiation devices to activate the doped layer and provide an activated doped layer. The activated doped layer may be one of a single doped layer or a plurality of successive doped layers which each have respective conduction types that are one of identical or different. Device breakage and failure of the manufactured semiconductor element due to heat induced during laser irradiation are substantially prevented by this method.
Public/Granted literature
- US20080227277A1 Method of manufacturing semiconductor element Public/Granted day:2008-09-18
Information query
IPC分类: