Dendrite growth control circuit

Invention Grant

US07807562B2 Dendrite growth control circuit 失效

Title translation: 树枝生长控制电路

Please log in to see more content

Patent Title: Dendrite growth control circuit
Patent Title (中): 树枝生长控制电路
Application No.: US12256221

Application Date: 2008-10-22
Publication No.: US07807562B2

Publication Date: 2010-10-05
Inventor: Douglas B. Hershberger , Steven H. Voldman , Michael J. Zierak
Applicant: Douglas B. Hershberger , Steven H. Voldman , Michael J. Zierak
Applicant Address: US NY Armonk
Assignee: International Business Machines Corporation
Current Assignee: International Business Machines Corporation
Current Assignee Address: US NY Armonk
Agency: Roberts Mlotkowski Safran & Cole, P.C.
Agent Anthony Canale
Main IPC: H01L21/4763
IPC: H01L21/4763

Abstract:

A circuit is provided which prevents dendrite formation on interconnects during semiconductor device processing due to a dendrite-forming current. The circuit includes a switch located in at least one of the dendrite-forming current paths. The switch is configured to be open or in the “off” state during processing, and is configured to be closed or in the “on” state after processing to allow proper functioning of the semiconductor device. The switch may include an nFET or pFET, depending on the environment in which it is used to control or prevent dendrite formation. The switch may be configured to change to the “closed” state when an input signal is provided during operation of the fabricated semiconductor device.

Abstract(Chinese):

提供了一种电路，其防止由于树突形成电流而在半导体器件处理期间互连上的枝晶形成。电路包括位于至少一个枝晶形成电流路径中的开关。该开关被配置为在处理期间处于打开状态或处于“关闭”状态，并且在处理之后被配置为闭合或处于“接通”状态以允许半导体器件正常工作。开关可以包括nFET或pFET，这取决于其用于控制或防止枝晶形成的环境。当在制造的半导体器件的操作期间提供输入信号时，开关可以被配置为改变为“闭合”状态。

Public/Granted literature

US20090035933A1 DENDRITE GROWTH CONTROL CIRCUIT Public/Granted day:2009-02-05

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/02	.半导体器件或其部件的制造或处理
H01L21/04	..至少具有一个跃变势垒或表面势垒的器件，例如PN结、耗尽层、载体集结层
H01L21/34	...具有H01L21/06，H01L21/16及H01L21/18各组不包含的或有或无杂质，例如掺杂材料的半导体的器件
H01L21/46	....用H01L21/36至H01L21/428各组不包含的方法或设备处理半导体材料的（在半导体材料上制作电极的入H01L21/44）
H01L21/461	.....改变半导体材料的表面物理特性或形状的，例如腐蚀、抛光、切割
H01L21/4763	......非绝缘层的沉积，例如绝缘层上的导电层、电阻层；这些层的后处理（电极的制造入H01L21/28）