Invention Grant
US07807736B2 Semiconductor device encapsulated by silicone resin composition, and silicone resin tablet for encapsulating semiconductor device
有权
用硅树脂组合物封装的半导体器件，以及用于封装半导体器件的硅树脂片剂
- Patent Title: Semiconductor device encapsulated by silicone resin composition, and silicone resin tablet for encapsulating semiconductor device
- Patent Title (中): 用硅树脂组合物封装的半导体器件，以及用于封装半导体器件的硅树脂片剂
-
Application No.: US11778980Application Date: 2007-07-17
-
Publication No.: US07807736B2Publication Date: 2010-10-05
- Inventor: Tsutomu Kashiwagi , Toshio Shiobara
- Applicant: Tsutomu Kashiwagi , Toshio Shiobara
- Applicant Address: JP Tokyo
- Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2006-195492 20060718
- Main IPC: C08K5/3477
- IPC: C08K5/3477 ; C08G77/00
Abstract:
A semiconductor device which is not a light emitting semiconductor device is provided. This device is encapsulated with a silicone resin composition which is solid at room temperature and liquid at molding temperature, and which cures into a transparent article having a hardness measured by Type D durometer according to JIS K 6253 of at least 30 and an elongation in a tensile test of at least 5%.
Public/Granted literature
Information query
