Invention Grant
- Patent Title: Laser processing apparatus and laser processing method
- Patent Title (中): 激光加工设备和激光加工方法
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Application No.: US11283262Application Date: 2005-11-17
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Publication No.: US07807940B2Publication Date: 2010-10-05
- Inventor: Masayuki Nishiwaki , Junichiro Iri , Genji Inada , Sadayuki Sugama
- Applicant: Masayuki Nishiwaki , Junichiro Iri , Genji Inada , Sadayuki Sugama
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Canon USA Inc IP Division
- Priority: JP2004-335395 20041119
- Main IPC: B23K26/14
- IPC: B23K26/14

Abstract:
A laser processing apparatus, in accordance with at least one exemplary embodiment, is configured to contemporaneously perform the functions of observing a surface of a substrate and concentrating laser light to a given position inside the substrate. The laser processing apparatus can include an optical system having an afocal optical subsystem configured to concentrate laser light inside the substrate. Adjustment of the position of a laser light concentrating point can be achieved independent of adjustment of a focal point by the automatic focusing mechanism to observe the surface of the substrate irradiated with laser light.
Public/Granted literature
- US20060108339A1 Laser processing apparatus and laser processing method Public/Granted day:2006-05-25
Information query
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