Invention Grant
- Patent Title: Imager module packaging having top and bottom glass layers
- Patent Title (中): 成像模块包装具有顶部和底部的玻璃层
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Application No.: US12216319Application Date: 2008-07-02
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Publication No.: US07807960B2Publication Date: 2010-10-05
- Inventor: Avi Strum
- Applicant: Avi Strum
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Main IPC: H01J40/14
- IPC: H01J40/14
Abstract:
An imaging device module includes a circuit mounting layer; a bottom glass layer disposed above the circuit mounting layer; a silicon die disposed above the bottom glass layer; a top glass layer disposed above the silicon layer; and a lens holder disposed above the top glass layer. The silicon die includes an image sensor. The lens holder contains an optical component.
Public/Granted literature
- US20090095893A1 Imager module packaging Public/Granted day:2009-04-16
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