Invention Grant
- Patent Title: Silicon carbide semiconductor device
- Patent Title (中): 碳化硅半导体器件
-
Application No.: US12285351Application Date: 2008-10-02
-
Publication No.: US07808003B2Publication Date: 2010-10-05
- Inventor: Takeshi Endo , Eiichi Okuno
- Applicant: Takeshi Endo , Eiichi Okuno
- Applicant Address: JP Kariya
- Assignee: DENSO CORPORATION
- Current Assignee: DENSO CORPORATION
- Current Assignee Address: JP Kariya
- Agency: Posz Law Group, PLC
- Priority: JP2007-262031 20071005
- Main IPC: H01L29/15
- IPC: H01L29/15 ; H01L31/0312

Abstract:
A silicon carbide semiconductor device is disclosed. The silicon carbide semiconductor device includes a substrate; a drift layer having a first conductivity type and located on a first surface of the substrate; and a vertical type semiconductor element. The vertical type semiconductor element includes: an impurity layer having a second conductivity type, and located in a surface portion of the drift layer; and a first conductivity type region located in the drift layer, spaced away from the impurity layer, located closer to the substrate than the impurity layer, and having an impurity concentration higher than the drift layer.
Public/Granted literature
- US20090090920A1 Silicon carbide semiconductor device Public/Granted day:2009-04-09
Information query
IPC分类: