Invention Grant
- Patent Title: Ferroelectric polymer memory module
- Patent Title (中): 铁电聚合物记忆模块
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Application No.: US10951017Application Date: 2004-09-27
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Publication No.: US07808024B2Publication Date: 2010-10-05
- Inventor: Lee D. Rockford , Ebrahim Andideh
- Applicant: Lee D. Rockford , Ebrahim Andideh
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H01L29/76
- IPC: H01L29/76

Abstract:
A ferroelectric polymer memory module includes a first set of layers including: a first ILD layer defining trenches therein; a first electrode layer disposed in the trenches of the first ILD layer; a first conductive polymer layer disposed on the first electrode layer and in the trenches of the first ILD layer; and a ferroelectric polymer layer disposed on the first conductive polymer layer and in the trenches of the first ILD layer; and a second set of layers disposed on the first set of layers to define memory cells therewith, the second set of layers including: a second ILD layer defining trenches therein; a second conductive polymer layer disposed in the trenches of the second ILD layer; and a second electrode layer disposed on the second conductive polymer layer.
Public/Granted literature
- US20060071256A1 Ferroelectric polymer memory device including polymer electrodes and method of fabricating same Public/Granted day:2006-04-06
Information query
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