Invention Grant
- Patent Title: Semiconductor device and semiconductor integrated circuit using the same
- Patent Title (中): 半导体器件和半导体集成电路使用相同
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Application No.: US12767548Application Date: 2010-04-26
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Publication No.: US07808045B2Publication Date: 2010-10-05
- Inventor: Takayuki Kawahara , Masanao Yamaoka
- Applicant: Takayuki Kawahara , Masanao Yamaoka
- Applicant Address: JP Tokyo
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Tokyo
- Agency: Miles & Stockbridge P.C.
- Priority: JP2005-222708 20050801
- Main IPC: H01L23/62
- IPC: H01L23/62

Abstract:
The present invention provides a high speed and low power consumption LSI operable in a wide temperature range in which a MOS transistor having back gates is used specifically according to operating characteristics of a circuit.In the LSI, an FD-SOI structure having an embedded oxide film layer is used and a lower semiconductor region of the embedded oxide film layer is used as a back gate. A voltage for back gates in the logic circuits having a small load in the logic circuit block is controlled in response to activation of the block from outside of the block. Transistors, in which the gate and the back gate are connected to each other, are used for the circuit generating the back gate driving signal, and logic circuits having a heavy load such as circuit block output section, and the back gates are directly controlled according to the gate input signal.
Public/Granted literature
- US20100201429A1 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR INTEGRATED CIRCUIT USING THE SAME Public/Granted day:2010-08-12
Information query
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