Invention Grant
- Patent Title: Semiconductor integrated circuit device
- Patent Title (中): 半导体集成电路器件
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Application No.: US11907327Application Date: 2007-10-11
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Publication No.: US07808056B2Publication Date: 2010-10-05
- Inventor: Hiroshi Furuta , Junji Monden , Shouzou Uchida , Muneaki Matsushige
- Applicant: Hiroshi Furuta , Junji Monden , Shouzou Uchida , Muneaki Matsushige
- Applicant Address: JP Kanagawa
- Assignee: NEC Electronics Corporation
- Current Assignee: NEC Electronics Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Foley & Lardner LLP
- Priority: JP2006-294755 20061030
- Main IPC: H01L27/088
- IPC: H01L27/088

Abstract:
A semiconductor integrated circuit device includes a first field-effect transistor and a second field-effect transistor, each of the first field-effect transistor and the second field-effect transistor having a gate electrode formed as a ring shape, a drain diffusion layer formed inside the gate electrode and a source diffusion layer formed outside the gate electrode and a substrate potential diffusion layer or a well potential diffusion layer disposed to contact each of the source diffusion layers of the first and the second field-effect transistors of the same conductivity type, the substrate potential diffusion layer or the well potential diffusion layer being formed with a semiconductor of a different conductivity type from the source diffusion layer. Different signals are input to each of the gate electrodes, the substrate potential diffusion layer or the well potential diffusion layer are formed between the source diffusion layer of the first field-effect transistor and the source diffusion layer of the second field-effect transistor.
Public/Granted literature
- US20080099857A1 Semiconductor integrated circuit device Public/Granted day:2008-05-01
Information query
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