Invention Grant
- Patent Title: Circuit arrangement and integrated circuit
- Patent Title (中): 电路布置和集成电路
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Application No.: US11758953Application Date: 2007-06-06
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Publication No.: US07808079B2Publication Date: 2010-10-05
- Inventor: Winfried Bakalski , Michael Asam , Markus Zannoth , Krzysztof Kitlinski
- Applicant: Winfried Bakalski , Michael Asam , Markus Zannoth , Krzysztof Kitlinski
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Eschweiler & Associates, LLC
- Main IPC: H01L23/58
- IPC: H01L23/58

Abstract:
A circuit arrangement includes a plurality of type-identical and identically operated active components, or separate sections of an active component, and includes a branched wiring structure for the interconnection of component connections. In each case the wiring end portions lie between a branching point and an input of different components or sections, wherein the wiring end portions are formed with predetermined geometrical asymmetry with respect to one another in such a way that there is an electrical symmetry of the interconnection configuration between all the connected type-identical components or sections. More particularly, the impedance values between the branching point and the different inputs and outputs are substantially identical.
Public/Granted literature
- US20080303165A1 CIRCUIT ARRANGEMENT AND INTEGRATED CIRCUIT Public/Granted day:2008-12-11
Information query
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