Invention Grant
- Patent Title: Thin film conductor and method of fabrication
- Patent Title (中): 薄膜导体和制造方法
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Application No.: US11502918Application Date: 2006-08-11
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Publication No.: US07808108B2Publication Date: 2010-10-05
- Inventor: Beom-seok Cho , Je-hun Lee , Chang-oh Jeong , Yang-ho Bae
- Applicant: Beom-seok Cho , Je-hun Lee , Chang-oh Jeong , Yang-ho Bae
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Innovation Counsel LLP
- Priority: KR10-2005-0074455 20050812
- Main IPC: H01L29/43
- IPC: H01L29/43
Abstract:
A thin film conductor having improved adhesion and superior conductivity, a method for fabricating the same, a thin film transistor (TFT) plate including the thin film conductor, and a method for fabricating the TFT plate are provided. The thin film conductor includes an adhesive layer containing an oxidation-reactive metal or silicidation-reactive metal and silver, a silver conductive layer formed on the adhesive layer, and a protection layer formed on the silver conductive layer and containing an oxidation-reactive metal and silver.
Public/Granted literature
- US20070034954A1 Thin film conductor and method of fabrication Public/Granted day:2007-02-15
Information query
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