Invention Grant
- Patent Title: Test method of microstructure body and micromachine
- Patent Title (中): 微结构体和微机械的试验方法
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Application No.: US11565135Application Date: 2006-11-30
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Publication No.: US07808253B2Publication Date: 2010-10-05
- Inventor: Mayumi Yamaguchi , Konami Izumi , Fuminori Tateishi
- Applicant: Mayumi Yamaguchi , Konami Izumi , Fuminori Tateishi
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Fish & Richardson P.C.
- Priority: JP2005-350035 20051202
- Main IPC: G01R27/32
- IPC: G01R27/32 ; G01R31/26

Abstract:
It is an object to provide a test method of a process, an electric characteristic, and a mechanical characteristic of a structure body in a micromachine without contact. A structure body including a first conductive layer, a second conductive layer provided in parallel to the first conductive layer, and a sacrifice layer or a space provided between the first conductive layer and the second conductive layer is provided; an antenna connected to the structure body is provided; electric power is supplied to the structure body wirelessly through the antenna; and an electromagnetic wave generated from the antenna is detected as a characteristic of the structure body.
Public/Granted literature
- US20070143048A1 TEST METHOD OF MICROSCTRUCTURE BODY AND MICROMACHINE Public/Granted day:2007-06-21
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