Invention Grant
- Patent Title: Isolated conductive leads extending across to opposite sides of IC
- Patent Title (中): 隔离导电引线延伸到IC的相对侧
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Application No.: US11850436Application Date: 2007-09-05
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Publication No.: US07808264B2Publication Date: 2010-10-05
- Inventor: Lee Whetsel
- Applicant: Lee Whetsel
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Lawrence J. Bassuk; W. James Brady; Frederick J. Telecky, Jr.
- Main IPC: G01R31/26
- IPC: G01R31/26
Abstract:
An integrated circuit includes switching circuits for selectively connecting the bond pads to functional core logic and isolating the bond pads from second conductors, and the switch circuits for selectively connecting the bond pads to the second conductors to provide bi-directional connections between the bond pads on opposite sides of the substrate and isolating the bond pads from the functional core logic.
Public/Granted literature
- US20070296441A1 Method and Apparatus for Die Testing on Wafer Public/Granted day:2007-12-27
Information query
