Invention Grant
- Patent Title: Substrate processing apparatus
- Patent Title (中): 基板加工装置
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Application No.: US11991093Application Date: 2006-09-26
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Publication No.: US07808396B2Publication Date: 2010-10-05
- Inventor: Tsukasa Iida , Akihiko Yoneda , Kaori Inoshima
- Applicant: Tsukasa Iida , Akihiko Yoneda , Kaori Inoshima
- Applicant Address: JP Tokyo
- Assignee: Hitachi Kokusai Electric, Inc.
- Current Assignee: Hitachi Kokusai Electric, Inc.
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2005-277618 20050926; JP2006-159513 20060608
- International Application: PCT/JP2006/319014 WO 20060926
- International Announcement: WO2007/034957 WO 20070329
- Main IPC: G08B3/00
- IPC: G08B3/00

Abstract:
It is intended to provide a substrate processing apparatus capable of reliably informing a running state of the apparatus. The substrate processing apparatus 100 having a signal indicator for indicating the running state, including a signal indicator 306 capable of setting at least one operation condition under which the signal indicator 306 operates as well as of operating under any one of a plurality of operation conditions and a display unit 314 capable of displaying that a cause of the operation is any one of the operation conditions during the operation of the signal indicator 306.
Public/Granted literature
- US20090072990A1 Substrate processing apparatus Public/Granted day:2009-03-19
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