Invention Grant
- Patent Title: Imaging module and method of manufacturing imaging module
- Patent Title (中): 成像模块及成像模块制造方法
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Application No.: US11934420Application Date: 2007-11-02
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Publication No.: US07808551B2Publication Date: 2010-10-05
- Inventor: Hiroshi Ito , You Kondoh , Mikio Nakamura
- Applicant: Hiroshi Ito , You Kondoh , Mikio Nakamura
- Applicant Address: JP Tokyo
- Assignee: Olympus Corporation
- Current Assignee: Olympus Corporation
- Current Assignee Address: JP Tokyo
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Priority: JP2006-307636 20061114
- Main IPC: H04N5/225
- IPC: H04N5/225
Abstract:
An imaging module includes a flexible printed circuit board which has a first area on which a first functional element is mounted, a second area on which a second functional element is mounted, and a third area which is formed between the first area and the second area, an electronic component which is mounted on the first area, and an imaging device which is mounted on the second area. The flexible printed circuit board is formed by an insulating layer which is integrated, spreading over the first area, the second area, and the third area. The flexible printed circuit board is formed such that the flexible printed circuit board can be bent at least in the third area.
Public/Granted literature
- US20080111907A1 IMAGING MODULE AND METHOD OF MANUFACTURING IMAGING MODULE Public/Granted day:2008-05-15
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