A method for manufacturing a substrate, includes: coating the substrate with a first layer including a first metallic element by a dry deposition technique; coating the first layer with a photo resist layer; forming on the photo resist layer an exposure portion, a pair of non-exposure portions being in contact with the exposure portion and having a substantially parallel stripe-like plan shape, and a half exposure portion that is a part of an inner region of the non-exposure portions and an outer region of the non-exposure portions; removing the exposure portion and an upper portion of the half exposure portion, the upper portion having been exposed; forming an electrode portion and a wiring portion by etching the first layer exposed by removing the exposure portion; exposing the electrode portion and the wiring portion by removing the half exposure portion of which the upper portion has been removed, and forming a pair of banks by the pair of non-exposure portions; applying a treatment solution including a second metallic element on a recess portion formed by the wiring portion sandwiched between the pair of banks and the pair of banks by a droplet discharge technique; and forming a second layer including the second metallic element on the wiring portion by hardening the applied treatment solution to thicken the wiring portion.