Invention Grant
US07808781B2 Apparatus and methods for high-performance liquid cooling of multiple chips with disparate cooling requirements
失效
具有不同冷却要求的多个芯片的高性能液体冷却的装置和方法
- Patent Title: Apparatus and methods for high-performance liquid cooling of multiple chips with disparate cooling requirements
- Patent Title (中): 具有不同冷却要求的多个芯片的高性能液体冷却的装置和方法
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Application No.: US12120094Application Date: 2008-05-13
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Publication No.: US07808781B2Publication Date: 2010-10-05
- Inventor: Evan George Colgan , Michael Anthony Gaynes , John Harold Magerlein , Kenneth Charles Marston , Roger Ray Schmidt , Hilton T. Toy
- Applicant: Evan George Colgan , Michael Anthony Gaynes , John Harold Magerlein , Kenneth Charles Marston , Roger Ray Schmidt , Hilton T. Toy
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G06F1/20
Abstract:
Apparatus and methods are provided for packaging multi-chip modules with liquid cooling modules designed to provide different thermal resistances for effectively conducting heat from various chips with disparate cooling requirements while minimizing mechanical stresses in thermal bonds due to thermal excursions.
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