Invention Grant
- Patent Title: Multiple chip module cooling system and method of operation thereof
- Patent Title (中): 多芯片模块冷却系统及其操作方法
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Application No.: US12036572Application Date: 2008-02-25
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Publication No.: US07808783B2Publication Date: 2010-10-05
- Inventor: Gary F. Goth , Daniel J. Kearney , Paul M. Lucas , Donald W. Porter
- Applicant: Gary F. Goth , Daniel J. Kearney , Paul M. Lucas , Donald W. Porter
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent Gerry Monteleone
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
Disclosed herein is computer system having a first and second multiple chip modules (MCM) and a cooling module. The cooling module includes a first cooling loop associated with said first MCM and a first evaporator. The cooling module further includes a second cooling loop associated with said second MCM and a second evaporator. Each cooling loop is coupled to a common condenser that receives thermal energy from each cooling loop. A controller is coupled to the first and second cooling loop and adapts the operation of the first and second cooling loop in response to variances in operating conditions to provide cooling of the first and second MCM.
Public/Granted literature
- US20090219681A1 MULTIPLE CHIP MODULE COOLING SYSTEM AND METHOD OF OPERATION THEREOF Public/Granted day:2009-09-03
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