A thermal conduction structure is integrated into a multi-layer circuit board to thermally couple a power electronic device to a heatsink while electrically isolating the power electronic device from the heatsink. The thermal conduction structure includes a stack of alternatingly insulative and conductive layers, a first set of vertical vias that thermally and electrically join the power electronic device to a first set of conductive layers, and a second set of vertical vias that thermally and electrically join the heatsink to a second set of conductive layers that are interleaved with the first set of conductive layers.