Invention Grant
- Patent Title: Electronic component module and method for manufacturing the same
- Patent Title (中): 电子元件模块及其制造方法
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Application No.: US11852888Application Date: 2007-09-10
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Publication No.: US07808796B2Publication Date: 2010-10-05
- Inventor: Hidefumi Hatanaka , Tsutomu Adachi , Youichi Yokote , Miho Imashioya , Tomohiko Taniguchi
- Applicant: Hidefumi Hatanaka , Tsutomu Adachi , Youichi Yokote , Miho Imashioya , Tomohiko Taniguchi
- Applicant Address: JP Kyoto JP Tokyo
- Assignee: Kyocera Corporation,Kyocera Kinseki Corporation
- Current Assignee: Kyocera Corporation,Kyocera Kinseki Corporation
- Current Assignee Address: JP Kyoto JP Tokyo
- Agency: Hogan Lovells US LLP
- Priority: JP2005-067714 20050310
- Main IPC: H05K7/00
- IPC: H05K7/00
Abstract:
An electronic component module comprises a circuit board having a cavity in one principal surface thereof. The electronic component module also comprises a first semiconductor device accommodated within the cavity and a second semiconductor device disposed on the one principal surface of the circuit board so as to cover the first semiconductor device in plan view. The electronic component module further comprises a resin material disposed to cover at least a side surface of the second semiconductor device.
Public/Granted literature
- US20080192443A1 Electronic Component Module and Method for Manufacturing the Same Public/Granted day:2008-08-14
Information query
