Invention Grant
US07809019B2 Bonding circuit for a line card and method for bonding data fragments 有权
用于线卡的接合电路和数据片段的绑定方法

  • Patent Title: Bonding circuit for a line card and method for bonding data fragments
  • Patent Title (中): 用于线卡的接合电路和数据片段的绑定方法
  • Application No.: US11635290
    Application Date: 2006-12-07
  • Publication No.: US07809019B2
    Publication Date: 2010-10-05
  • Inventor: Jochen Kraus
  • Applicant: Jochen Kraus
  • Applicant Address: DE Neubiberg
  • Assignee: Lantiq Deutschland GmbH
  • Current Assignee: Lantiq Deutschland GmbH
  • Current Assignee Address: DE Neubiberg
  • Agency: SpryIP, LLC
  • Priority: DE102005058982 20051209
  • Main IPC: H04J3/24
  • IPC: H04J3/24
Bonding circuit for a line card and method for bonding data fragments
Abstract:
In a method for bonding data fragments, data fragments are delayed in such a manner that a first transmission time for a direct transmission of data fragments between a master line card and a terminal connection via a first group of subscriber lines of a telephone line bundle corresponds to a second transmission time for an indirect transmission of data fragments between the master line card, an uplink card, and a further line card via a second group of subscriber lines of the line bundle.
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