Invention Grant
US07809019B2 Bonding circuit for a line card and method for bonding data fragments
有权
用于线卡的接合电路和数据片段的绑定方法
- Patent Title: Bonding circuit for a line card and method for bonding data fragments
- Patent Title (中): 用于线卡的接合电路和数据片段的绑定方法
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Application No.: US11635290Application Date: 2006-12-07
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Publication No.: US07809019B2Publication Date: 2010-10-05
- Inventor: Jochen Kraus
- Applicant: Jochen Kraus
- Applicant Address: DE Neubiberg
- Assignee: Lantiq Deutschland GmbH
- Current Assignee: Lantiq Deutschland GmbH
- Current Assignee Address: DE Neubiberg
- Agency: SpryIP, LLC
- Priority: DE102005058982 20051209
- Main IPC: H04J3/24
- IPC: H04J3/24

Abstract:
In a method for bonding data fragments, data fragments are delayed in such a manner that a first transmission time for a direct transmission of data fragments between a master line card and a terminal connection via a first group of subscriber lines of a telephone line bundle corresponds to a second transmission time for an indirect transmission of data fragments between the master line card, an uplink card, and a further line card via a second group of subscriber lines of the line bundle.
Public/Granted literature
- US20070140286A1 Bonding circuit for a line card and method for bonding data fragments Public/Granted day:2007-06-21
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