Invention Grant
- Patent Title: Grinding apparatus
- Patent Title (中): 研磨机
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Application No.: US12249592Application Date: 2008-10-10
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Publication No.: US07811154B2Publication Date: 2010-10-12
- Inventor: Wei-Cheng Ling , Da-Wei Lin
- Applicant: Wei-Cheng Ling , Da-Wei Lin
- Applicant Address: TW Tu-Cheng, Taipei Hsien
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW Tu-Cheng, Taipei Hsien
- Agent Andrew C. Cheng
- Priority: CN200810300682 20080324
- Main IPC: B24B7/00
- IPC: B24B7/00

Abstract:
A grinding apparatus for grinding workpieces includes two clamping rods and a base. Each of the two clamping rods has a first end and an opposite second end. The first ends are opposite to each other for clamping workpieces therebetween. The base includes a receiving groove for receiving the workpieces therein and two positioning slots at opposite sides of the receiving groove. The positioning slots are aligned with each other and configured for receivingly engaging with the clamping rods to align the clamping rods with each other.
Public/Granted literature
- US20090239452A1 GRINDING APPARATUS Public/Granted day:2009-09-24
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