Invention Grant
- Patent Title: Metal-clad laminate and method for production thereof
- Patent Title (中): 覆金属层压板及其制造方法
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Application No.: US11718843Application Date: 2005-10-27
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Publication No.: US07811408B2Publication Date: 2010-10-12
- Inventor: Minoru Onodera , Tadao Yoshikawa
- Applicant: Minoru Onodera , Tadao Yoshikawa
- Applicant Address: JP Kurashiki-shi
- Assignee: Kuraray Co., Ltd.
- Current Assignee: Kuraray Co., Ltd.
- Current Assignee Address: JP Kurashiki-shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2004-326086 20041110
- International Application: PCT/JP2005/019781 WO 20051027
- International Announcement: WO2006/051693 WO 20060518
- Main IPC: B32B37/00
- IPC: B32B37/00 ; B29C65/00

Abstract:
A metal-clad laminate excellent in isotropy, appearance, bondability between a TLC polymer film and a metallic sheet, and dimensional stability is provided less costly with a first step of thermally compressing the film with the metallic sheet by passing them through a nipping region between heating rolls, and a second step of heat-treating the resultant metal-clad laminate at a temperature not higher than the melting point of the film, wherein the film has thermal expansion coefficient αL satisfying αL=βT+γ with thickness T, thickness coefficient β and anisotropy coefficient γ of the film; wherein the coefficient β is within the range of −0.08 to −0.01; the coefficient γ is within the range of αM+6≦γ≦αM+10 with thermal expansion coefficient αM of the metallic sheet; and thermal expansion coefficient αT of the film is within αM−2≦αT≦αM+3 with the coefficient αM.
Public/Granted literature
- US20080107833A1 Metal-Clad Laminate And Method For Production Thereof Public/Granted day:2008-05-08
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