Invention Grant
- Patent Title: Thermally enhanced electronic package
- Patent Title (中): 热增强电子封装
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Application No.: US12337347Application Date: 2008-12-17
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Publication No.: US07811862B2Publication Date: 2010-10-12
- Inventor: Anwar A. Mohammad , Soon Ing Chew
- Applicant: Anwar A. Mohammad , Soon Ing Chew
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Coats & Bennett, P.L.L.C.
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/48 ; H01L21/50
Abstract:
According to one embodiment, an electronic package includes a semiconductor die, a heat sink and a metallization layer interposed between the semiconductor die and the heat sink. The metallization layer attaches the semiconductor die to the heat sink. The metallization layer has a thickness of about 5 μm or less and a thermal conductivity of about 60 W/m·K or greater.
Public/Granted literature
- US20100148326A1 Thermally Enhanced Electronic Package Public/Granted day:2010-06-17
Information query
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