Invention Grant
- Patent Title: Vertical channel transistor structure and manufacturing method thereof
- Patent Title (中): 垂直沟道晶体管结构及其制造方法
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Application No.: US11545575Application Date: 2006-10-11
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Publication No.: US07811890B2Publication Date: 2010-10-12
- Inventor: Tzu-Hsuan Hsu , Yen-Hao Shih , Chia-Wei Wu
- Applicant: Tzu-Hsuan Hsu , Yen-Hao Shih , Chia-Wei Wu
- Applicant Address: TW Hsinchu
- Assignee: Macronix International Co., Ltd.
- Current Assignee: Macronix International Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Haynes Beffel & Wolfeld LLP
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
A vertical channel transistor structure is provided. The structure includes a substrate, a channel, a cap layer, a charge trapping layer, a source and a drain. The channel is formed in a fin-shaped structure protruding from the substrate. The cap layer is deposited on the fin-shaped structure. The cap layer and the fin-shaped structure have substantially the same width. The charge trapping layer is deposited on the cap layer and on two vertical surfaces of the fin-shaped structure. The gate is deposited on the charge trapping layer and on two vertical surfaces of the fin-shaped structure. The source and the drain are respectively positioned on two sides of the fin-shaped structure and opposite the gate.
Public/Granted literature
- US20080087946A1 Vertical channel transistor structure and manufacturing method thereof Public/Granted day:2008-04-17
Information query
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