Invention Grant
- Patent Title: Method for laminating substrate and apparatus using the method
- Patent Title (中): 使用该方法层压基板和设备的方法
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Application No.: US11949593Application Date: 2007-12-03
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Publication No.: US07811899B2Publication Date: 2010-10-12
- Inventor: Masayuki Yamamoto , Yukitoshi Hase
- Applicant: Masayuki Yamamoto , Yukitoshi Hase
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Cheng Law Group, PLLC
- Priority: JP2006-329730 20061206
- Main IPC: H01L23/58
- IPC: H01L23/58 ; H01L21/30 ; H01L21/46 ; B23B41/00 ; B23B41/02
Abstract:
A supporting substrate is laminated on a wafer in such a manner that the supporting substrate locked in peripheral edges with a plurality of locking claws is disposed in proximity to and facing to an adhering surface of a double-sided adhesive sheet on the workpiece, the supporting substrate is pressed by a pressing member made of an approximately hemispherical elastic body from an approximate center of a non-adhering surface of this supporting substrate, the supporting substrate is laminated by elastically deforming this pressing member on the wafer while making the supporting substrate surface contact in a flat condition.
Public/Granted literature
- US20080138936A1 METHOD FOR LAMINATING SUBSTRATE AND APPARATUS USING THE METHOD Public/Granted day:2008-06-12
Information query
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