Invention Grant
- Patent Title: Housing assembly for electronic device
- Patent Title (中): 电子设备外壳组件
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Application No.: US12194618Application Date: 2008-08-20
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Publication No.: US07812256B2Publication Date: 2010-10-12
- Inventor: Wen-Zhong Zhan
- Applicant: Wen-Zhong Zhan
- Applicant Address: CN ShenZhen, Guangdong Province HK Kowloon
- Assignee: Shenzhen Futaihong Precision Industry Co., Ltd.,FIH (Hong Kong) Limited
- Current Assignee: Shenzhen Futaihong Precision Industry Co., Ltd.,FIH (Hong Kong) Limited
- Current Assignee Address: CN ShenZhen, Guangdong Province HK Kowloon
- Agent Steven M. Reiss
- Priority: CN200810301860 20080530
- Main IPC: H02G3/14
- IPC: H02G3/14
Abstract:
A housing assembly (10) for use in a portable electronic device, includes base (14) and a decorative element (12). The base (14) has a securing portion (144) protruding therefrom; The decorative element (12) has a securing groove (126) corresponding to the securing portion (144) and the cross-sectional area of the securing groove (126) being smaller than the cross-sectional area of the securing portion (144); When the decorative element (12) is pressed toward the base (14), the decorative element (12) may be elastically deformed due to the pressing force, and the cross-sectional area of the securing groove (126) is enlarged so the securing portion (144) can be pushed in the securing groove (126); and when the pressing force is removed, the securing groove (126) begins trying to shrink to its original state so that the securing portion (144) is press-fit within the securing groove (126) to mount the decorative element (12) on the base (14).
Public/Granted literature
- US20090296327A1 HOUSING ASSEMBLY FOR ELECTRONIC DEVICE Public/Granted day:2009-12-03
Information query
IPC分类:
