Invention Grant
US07812333B2 Integrated circuit including resistivity changing material having a planarized surface
有权
包括具有平坦化表面的电阻率变化材料的集成电路
- Patent Title: Integrated circuit including resistivity changing material having a planarized surface
- Patent Title (中): 包括具有平坦化表面的电阻率变化材料的集成电路
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Application No.: US11770064Application Date: 2007-06-28
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Publication No.: US07812333B2Publication Date: 2010-10-12
- Inventor: Jan Boris Philipp , Thomas Happ
- Applicant: Jan Boris Philipp , Thomas Happ
- Applicant Address: US NC Durham
- Assignee: Qimonda North America Corp.
- Current Assignee: Qimonda North America Corp.
- Current Assignee Address: US NC Durham
- Agency: Coats & Bennett, P.L.L.C.
- Main IPC: H01L29/26
- IPC: H01L29/26 ; H01L31/032 ; H01L45/00
Abstract:
An integrated circuit includes a first electrode and a first resistivity changing material coupled to the first electrode. The first resistivity changing material has a planarized surface. The integrated circuit includes a second resistivity changing material contacting the planarized surface of the first resistivity changing material and a second electrode coupled to the second resistivity changing material. A cross-sectional width of the first resistivity changing material is less than a cross-sectional width of the second resistivity changing material.
Public/Granted literature
- US20090003032A1 INTEGRATED CIRCUIT INCLUDING RESISTIVITY CHANGING MATERIAL HAVING A PLANARIZED SURFACE Public/Granted day:2009-01-01
Information query
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