A multilayer composite body has an electronic function, in particular, an electronic subassembly comprising a plurality of organic electronic components, such as transistors, diodes, capacitors and so on, having at least one common layer, e.g., a semiconductor layer and/or insulation layer, wherein the common layer may be superfluous in one or more of the components. There thus is provided a structure of an entire subassembly such as an RFID tag, wherein the entire tag with all of its components is implemented in one production process.