Invention Grant
- Patent Title: Heat dissipation member, semiconductor apparatus and semiconductor light emitting apparatus
- Patent Title (中): 散热构件，半导体装置和半导体发光装置
-
Application No.: US12334272Application Date: 2008-12-12
-
Publication No.: US07812365B2Publication Date: 2010-10-12
- Inventor: Takashi Murayama
- Applicant: Takashi Murayama
- Applicant Address: JP Anan-shi
- Assignee: Nichia Corporation
- Current Assignee: Nichia Corporation
- Current Assignee Address: JP Anan-shi
- Agency: Ditthavong Mori & Steiner, P.C.
- Priority: JP2003-355399 20031015; JP2004-075577 20040317; JP2004-110817 20040405; JP2004-163491 20040601
- Main IPC: H01L33/00
- IPC: H01L33/00
Abstract:
A heat dissipation member includes a first plate-shaped member and a second plate-shaped member. The first plate-shaped member has a first surface thermally connectable with a heat generating element and a second surface. The second plate-shaped member is thermally connected with the second surface of the first plate-shaped member. The first plate-shaped member and the second plate-shaped member form a laminated-plate-shaped member. The laminated-plate-shaped member defines an inlet for admission of a fluid and an outlet communicating with the inlet for ejection of the fluid. The second surface of the first plate-shaped member forms asperities thereon.
Public/Granted literature
- US20090095960A1 HEAT DISSIPATION MEMBER, SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR LIGHT EMITTING APPARATUS Public/Granted day:2009-04-16
Information query
IPC分类:
